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Results 1 - 20 of 75 for "u:design-reuse.com" in Santa Clara, CA

  1. PCI-SIG Conference - Did you Know?Read the original story w/Photo

    Wednesday Jun 21 | Design And Reuse

    The PCI-SIG Developers Conference 2017 took place in the Santa Clara, California convention center on June 7-8. Today we will provide conference highlights, observations, and result of the 25-year anniversary dinner quiz.

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  2. GLOBALFOUNDRIES, ON Semiconductor Deliver the Industry's Lowest Power Bluetooth Low Energy SoC FamilyRead the original story w/Photo

    Monday Jun 19 | Design And Reuse

    ON Semiconductor's new RSL10 products are based on a multi-protocol Bluetooth 5 certified radio SoC capable of supporting the advanced wireless functionalities in IoT and "Connected" Health and Wellness markets. "Bluetooth low energy technology continues to advance as the key enabler for connecting IoT devices, especially with low power consumption requirements," said Robert Tong, vice president of ON Semiconductor's Medical and Wireless Products Division.

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  3. Runtime Accelerates Time to Market with New License Allocation Management SolutionRead the original story w/Photo

    Sunday Jun 18 | Design And Reuse

    SANTA CLARA, Calif.– June 19 2017 –Runtime, a leading provider of infrastructure and design optimization software solutions, introduced a new license allocation management solution, LicenseAllocator. LicenseAllocator is a policy-driven and real-time license allocation management solution that enables the seamless sharing of software licenses among users from multi-sites in the context of project priorities.

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  4. Silvaco to Acquire SoC SolutionsRead the original story w/Photo

    Monday Jun 19 | Design And Reuse

    June 15, 2017 -- Silvaco, Inc. today announced it has entered into a letter of intent to acquire SoC Solutions. Founded in 2000, SoC Solutions is a privately held company providing semiconductor IP and services located in the greater Atlanta, Georgia area.

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  5. Achronix Revenues to Grow 700% YoY and Exceed $100M in 2017Read the original story w/Photo

    Tuesday Jun 13 | Design And Reuse

    Santa Clara, Calif., June 14th, 2017 – Achronix announced today that its revenues will grow over 700% year-over-year and will exceed $100M in 2017. Achronix's exceptional growth is driven primarily by sales of its Speedster22i FPGA family and licensing of its Speedcore embedded FPGA IP products.

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  6. GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET TechnologyRead the original story w/Photo

    Tuesday Jun 13 | Design And Reuse

    Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure. Design kits are available now, and the first customer products based on 7LP are expected to launch in the first half of 2018, with volume production ramping in the second half of 2018.

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  7. GLOBALFOUNDRIES Launches 7nm ASIC Platform for Data Center, Machine Learning, and 5G NetworksRead the original story w/Photo

    Monday Jun 12 | Design And Reuse

    Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit offering built on the company's 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite of intellectual property and 2.5D/3D packaging to deliver the industry's most complete solution for data center, machine learning, automotive, wired communications, and 5G wireless applications.

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  8. Sensory and ARM Processors Enabling AI at the EdgeRead the original story w/Photo

    Friday May 26 | Design And Reuse

    With broad ARM compatibility, embedded technologies from Sensory allow device makers to enable artificial intelligence on device without needing a cloud connection Santa Clara, Calif., – May 25, 2017 – Sensory Inc., a Silicon Valley company focused on improving the user experience and security of consumer electronics through embedded artificial intelligence technologies, continues to expand its support for ARM® Cortex® processors as part of its commitment to make embedded AI more prevalent across numerous product categories.

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  9. Rambus to Demonstrate CryptoManager IoT Device Management with STMicroelectronicsRead the original story w/Photo

    May 17, 2017 | Design And Reuse

    SUNNYVALE, CA – May 16, 2017 – Rambus today announced it is teaming with STMicroelectronics to showcase its recently announced IoT Device Management service as part of its CryptoManager™ platform. Designed for the Internet of Things , the demo showcases an STM32 microcontroller connected to Rambus IoT Device Management.

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  10. Khronos Releases OpenVX 1.2 Specification for Cross-Platform...Read the original story w/Photo

    May 1, 2017 | Design And Reuse

    New functionality includes neural network acceleration, feature detection, image classification, and conditional graph processing. First public release of OpenVX SC for vision acceleration in safety critical systems May 1, 2017 – Embedded Vision Alliance Summit – Santa Clara, CA – The Khronos Group ™ , an open consortium of leading hardware and software companies, announces the immediate release of the OpenVX™ 1.2 specification for cross-platform acceleration of computer vision applications and libraries.

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  11. Aldec unveils the newest Xilinx Zynq-based TySOM Embedded Prototyping ...Read the original story w/Photo

    May 1, 2017 | Design And Reuse

    Santa Clara, USA. – May 1, 2017 – Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions for system and ASIC designs, unveils the new Xilinx® Zynq®-based TySOM™-2A-7Z030 Embedded Prototyping Board at Embedded Vision Summit to be held May 1-3, 2017, in Santa Clara, California.

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  12. Cadence Unveils Industry's First Neural Network DSP Ip for...Read the original story w/Photo

    May 1, 2017 | Design And Reuse

    EMBEDDED VISION SUMMIT, SANTA CLARA, Calif., May 1 , 2017 -- Cadence Design Systems, Inc. today unveiled the Cadence® Tensilica® Vision C5 DSP, the industry's first standalone, self-contained neural network DSP IP core optimized for vision, radar/lidar and fused-sensor applications with high-availability neural network computational needs. Targeted for the automotive, surveillance, drone and mobile/wearable markets, the Vision C5 DSP offers 1TMAC/sec computational capacity to run all neural network computational tasks.

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  13. eASIC and Comcores Announce Support for CPRI V7.0Read the original story w/Photo

    May 1, 2017 | Design And Reuse

    Santa Clara, CA – May, 01, 2017 – eASIC® Corporation , a fabless semiconductor company that delivers a custom integrated circuit platform , and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property , today announced the support of CPRI V7.0 for eASIC's Nextreme-3S family. With an increased line rate, up to 24.33 Gbps and improved line coding efficiency, CPRI v7.0 supports an increased RF signal bandwidth of up to 480 MHz needed for the proliferation of C-RAN fronthaul networks.

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  14. Renesas Electronics America, Intrinsic ID, and Medium One Introduce...Read the original story w/Photo

    May 1, 2017 | Design And Reuse

    RX231 Wi-Fi Cloud Connectivity Kit Integrates Renesas RX231 MCUs, Intrinsic ID IoT Authentication, and Medium One's Cloud Services and Workflows SANTA CLARA, Calif., May 1, 2017 – Renesas Electronics America Inc., a premier supplier of advanced semiconductor solutions; Intrinsic ID, a digital authentication company and inventor of SRAM Physical Unclonable Function ; and Medium One, a leading Internet of Things Data Intelligence company, today announced their collaboration on the RX231 Wi-Fi Cloud Connectivity Kit. Based on Renesas' popular RX231 Group of 32-bit microcontrollers , the new evaluation kit incorporates Intrinsic ID's "root-of-trust" SRAM PUF technology and Medium One's cloud services and IoT workflows.

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  15. asicNorth enhances IoT Design EcoSystem with IoT Endpoint ASIC PlatformRead the original story w/Photo

    Apr 24, 2017 | Design And Reuse

    Building on the momentum of their IoT Design EcoSystem, asicNorth announced today the debut of an IoT Endpoint ASIC Platform to further accelerate the deployment of custom IoT endpoint devices for their customers. The IoT Endpoint ASIC Platform is structured to be highly configurable enabling support for various radio protocols, ARM Cortex®-M0 compatible peripherals, analog/mixed-signal requirements, and external sensors.

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  16. Geon Secure Execution Processor Brings Royalty-Free Protection to IoT DevicesRead the original story w/Photo

    Apr 26, 2017 | Design And Reuse

    IP core now available from CAST cryptographically protects critical code and data within a low-power, high-performance 32-bit processor IoT DevCon, Santa Clara, CA, April 26 2017 -- Semiconductor intellectual property provider CAST, Inc. today announced the availability of an IP core that builds secure code execution into a 32-bit processor suitable for embedded systems and Internet of Things devices. The Geon™ Secure Execution Processor uses two or more cryptographically separated execution contexts for a high degree of security during code execution and for data storage and transfer to and from the processor.

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  17. Wave Computing and Sonics to Present on Deep Learning Technology At ML DevConRead the original story w/Photo

    Apr 26, 2017 | Design And Reuse

    San Jose, Calif. – April 25, 2017 – Sonics, Inc., the world's foremost supplier of on-chip network and power management technologies and services, and Wave Computing today announced that the companies will jointly deliver a technical presentation on Deep Learning technology at the Machine Learning Developers Conference on Thursday, April 27th 2017.

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  18. eASIC and Mobiveil Announce Flash Reliability PlatformRead the original story w/Photo

    Apr 25, 2017 | Design And Reuse

    Santa Clara, CA – May 4, 2016 – eASIC® Corporation ), a fabless semiconductor company that delivers a custom integrated circuits platform , and Mobiveil, Inc., a fast growing supplier of Silicon Intellectual Properties and Platforms, today announced that Mobiveil's Flash Reliability IP is now available for use in the eASIC Nextreme-3S family. The Flash Reliability IP Platform contains an LDPC engine with a Flash Interface, Flash Soft-Information Generation and Flash Monitoring and Analysis.

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  19. NXP Shows First FD-SOI ChipsRead the original story w/Photo

    Apr 14, 2017 | Design And Reuse

    SANTA CLARA, Calif. – NXP will ship this year as many as five SoCs made in Samsung's 28nm fully depleted silicon-on-insulator process, including one that has been sampling for six months.

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  20. Synapse Design Acquires Asilicon to Address Customer Demand and...Read the original story w/Photo

    Apr 13, 2017 | Design And Reuse

    Santa Clara, Calif. And Bangalore, India – April 12, 2017 – Synapse Design Inc., the leading design services partner serving Tier 1 system and semiconductor companies, today announced that the Company has acquired Asilicon, an engineering design services firm based in Ranchi Jharkhand, India.

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